UHP PFA 易熔管件(最大尺寸为 2 英寸)- PARBOND 系列
UHP PFA Fusible Pipe Fittings (sizes up to 2 inch) – Parbond Series
Parbond 系列 PFA 易熔管接头具有高泄漏完整性,旨在在高流量、最小压降应用中产生永久连接。它们是超高纯度 (UHP) 和腐蚀性化学管道系统的理想选择。Parbond 系列 PFA 易熔管接头具有极高的泄漏完整性,使其非常适合用于超高纯度应用,包括半导体工厂管道、工具连接和腐蚀性化学品处理管线。这些配件设计用于在高流量、最小压降的管道系统中产生永久的密封连接。
Parbond 系列管件有多种尺寸(1/4 英寸至 2 英寸)和配置(弯头、活接头、三通或异径管),以满足客户系统的独特要求。它们由高纯度的半导体级 PFA 材料制成,可以直接焊接到 PFA 管道上,从而确保建立可靠、无泄漏的连接。
Parbond 系列接头的粘合是通过用非接触式热源将两个表面加热到熔融状态,将两个表面压在一起,并留出足够的时间冷却来完成的。正确的技术可以在不引入异物或表面颗粒的情况下实现永久连接,从而实现出色的清洁度。
许多 Parbond 系列配置都配备了 Redi-flare 端接,可节省空间并能够在狭窄区域使用,例如阀歧管盒 (VMB)。根据客户对非接液材料的选择,管件可适应各种温度、压力和工艺流体,使其成为在可靠性和最小颗粒生成至关重要的操作中消除管接头泄漏的经济选择。
UHP PFA 易熔管件(最大尺寸为 2 英寸)- PARBOND 系列
UHP PFA Fusible Pipe Fittings (sizes up to 2 inch) – Parbond Series
市场:
- 半导体
- 分析实验室
- 制药
- 生物制药
- 航空航天
- 工业
特性/优势:
- 防漏密封最大限度地减少颗粒产生和过程污染
- 非常适合超高压、高流量、最小压降管道系统
- 提供多种尺寸(1/4 英寸至 2 英寸)和配置(弯头、三通、异径管、活接头)
- 高完整性熔焊连接比传统接头产生更好的密封
- Redi-flare 端连接节省空间,可在狭窄区域使用
应用:
-腐蚀性和特殊化学品、酸、碱和浆液
- 半导体工具
- 工具连接
- 阀歧管箱 (VMB)
- CMP/浆料系统
UHP PFA Fusible Pipe Fittings (sizes up to 2 inch) – Parbond Series
Parbond Series PFA Fusible Pipe Fittings
Parbond Series PFA Fusible Pipe Fittings offer high leak integrity and are designed to yield a permanent connection in high-flow, minimal pressure drop applications. They are ideal for ultra-high purity (UHP) and corrosive chemical piping systems.
Parbond Series PFA Fusible Pipe Fittings offer extremely high leak integrity, making them ideal for use in ultra-high purity applications, including semiconductor fab piping runs, tool connections, and corrosive chemical handling lines. The fittings are designed to yield a permanent leak-tight connection in high flow, minimal pressure drop piping systems.
Parbond Series pipe fittings are available in a variety of sizes (1/4 inch to 2 inch) and configurations (elbow, union, tee or reducer) to meet the unique requirements of customers’ systems. They are fabricated from high-purity, semiconductor-grade PFA material and can be welded directly to PFA piping, thus ensuring the creation of a reliable, leak-free connection.
Bonding of Parbond Series fittings is accomplished by heating the two surfaces with a non-contact heat source to a molten state, pressing the two surfaces together, and allowing sufficient time to cool. Proper technique results in a permanent connection being made without introducing foreign matter or surface particulates for exceptional cleanliness.
Many Parbond Series configurations are equipped with Redi-flare end connections, which save space and enable use in tight areas, such as valve manifold boxes (VMBs). The pipe fittings can accommodate a wide range of temperature, pressure, and process fluids depending on the customer’s choice of non-wetted materials – making them an economical choice for eliminating pipe union leaks in operations where reliability and minimal particle generation are critical.
Markets:
- Semiconductor
- Analytical Laboratory
- Pharmaceutical
- BioPharm
- Aerospace
- Industrial
Features/Benefits:
- Leak-tight seal minimizes particle generation and process contamination
- Ideal for UHP, high-flow, minimal pressure drop piping systems
- Available in a variety of sizes (1/4 inch to 2 inch) and configurations (elbow, tee, reducer, union)
- High integrity fused weld connections yields better seal than conventional fittings
- Redi-flare end connections save space and enable use in tight areas
Applications:
- Corrosive and specialty chemicals, acids, bases, and slurries
- Semiconductor Tools
- Tool Hook-ups
- Valve Manifold Boxes (VMB)
- CMP/Slurry systems
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